Custom Build

Embedded development
designed to purpose,
from circuit to AI

We realize requirements that off-the-shelf products cannot meet with custom hardware and firmware. From circuit design and PCB layout to firmware development and onboard edge AI, we design with you step by step.

  • Circuit design
  • PCB layout
  • Firmware
  • RTOS
  • Edge AI
  • Mass-production support

* Example product screen layout. The actual screen may vary depending on the development scope.

End-to-EndOne-stop: requirements → circuit → PCB
→ firmware → mass production
Edge AILightweight AI models
can run on MCU/SoC
Industrial-gradeWide-temperature and EMI design
for industrial environments
PoC→mass productionSupport from prototype
to mass-production design
// 01 — OVERVIEW
When to choose custom

Consider custom development in these situations

Off-the-shelf products do not fit your environment

When special requirements such as size, power, interfaces, or certification make it difficult to use off-the-shelf products as is.

You want to run AI directly on the edge

You want to load a lightweight inference model onto an MCU or small SoC so the device itself can make decisions without a network.

You need IP protection and cost optimization

When you plan to mass-produce as your own product or supply via OEM after development, and need to reduce external dependency.

// 02 — HOW IT WORKS
Development process

Step-by-step development process
from requirements to mass production

At each stage you review the deliverables before moving to the next. The scope can also be adjusted if you only need a prototype.

1

Requirements analysis

We organize the purpose, operating environment, interfaces, certification requirements, and budget and schedule. After reviewing similar cases, we finalize the development scope.

2

Circuit design and review

We proceed in the order of block diagram → schematic design → simulation verification. Component selection and the supply chain are also reviewed at this stage.

3

PCB layout and prototype

We lay out the PCB with EMI and thermal design in mind, then build a prototype. Signal integrity and power stability are verified by actual measurement.

4

Firmware development and AI onboarding

We develop RTOS-based firmware, the communication stack, and sensor drivers. If edge AI onboarding is needed, we also optimize lightweight models.

5

Validation and mass-production support

After functional and environmental testing, we prepare a mass-production design guide. When needed, we also support the certification (KC, CE, etc.) acquisition process.

// 03 — FEATURES
Development scope

Development scope

Scope 01

Hardware design — circuit and PCB

We handle the entire process, from MCU/MPU selection to peripheral circuit design, power and communication interface configuration, and PCB layout.

  • Platform choices such as STM32, ESP32, NXP i.MX, and Raspberry Pi CM
  • Mixed analog and digital circuit design
  • Industrial wide-temperature (-40 to 85°C) design
  • Layout with EMI/EMC design considerations
Scope 02

Firmware development — RTOS, drivers, and communication

We develop purpose-fit firmware, from the hardware abstraction layer to RTOS task design, sensor drivers, and the communication stack.

  • Multitasking design based on FreeRTOS and Zephyr
  • Modbus, CAN, MQTT, BLE, and Wi-Fi communication implementation
  • Low-power sleep mode optimization
  • OTA (over-the-air update) feature implementation
Scope 03

Edge AI onboarding

We optimize and load lightweight AI models onto the MCU or NPU so inference runs on the device itself, without a cloud connection.

  • TensorFlow Lite / ONNX Runtime optimization
  • Onboarding of anomaly detection, classification, and prediction models
  • Optimization leveraging the NPU (Neural Processing Unit)
  • Design balancing model accuracy, inference speed, and memory
// 04 — USE CASES
Use cases

Which projects this applies to

🏭 Smart sensor module

Custom development of a wireless vibration and temperature collection module

Development of a wireless vibration and temperature collection module attached to the outside of equipment. BLE-based battery-powered design enables installation without wiring. Integrates with EGNOX Edge HMI.

Can be installed without wiringLow-power battery-driven design
🤖 Industrial control device

Interface board development for legacy equipment with non-standard communication

Custom interface board development for equipment with proprietary protocols that off-the-shelf gateways cannot connect to. Converts to Modbus and connects to EGNOX IoT.

Proprietary protocol conversion implementedCan replace off-the-shelf products
🔍 AI vision edge device

Development of a vision inference board with built-in NPU

Development of a compact board that runs vision AI inference on the floor without the cloud. An optimized EGNOX Vision model is loaded onto the NPU. Direct camera connection design.

Offline vision inferenceCompact, low-power design
// 05 — SPEC
Capabilities

Development capabilities summary

MCU/MPU platformsSTM32, ESP32, NXP i.MX, RPi CM, Nordic nRF
Communication interfacesUART, SPI, I2C, CAN, RS-485, BLE, Wi-Fi, LTE
RTOSFreeRTOS, Zephyr, Bare-metal
PCB designMultilayer boards with 4 or more layers, high-speed signal design
Edge AI frameworksTensorFlow Lite, ONNX Runtime, OpenVINO
Industrial environment supportWide-temperature (-40 to 85°C), EMI/EMC, and IP-rated design
Certification supportSupport for the KC, CE, and FCC acquisition process
Mass-production supportPrototype → low-volume production → high-volume production linkage
Next step

Tell us briefly about
your project's purpose and the features you need

Share why off-the-shelf products fall short, your target specifications, and your budget and schedule range, and we will first outline the feasible development scope and our approach.

Contact sales